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Microfabrication Class Notes 2021 11 22

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Revision as of 07:11, 23 November 2021 by Msavage (talk | contribs) (→‎Attendees)

Attendees

Mario - PhD speciality with microfab Ben (in Colorado...moved from DC) - elec eng Tristan - instructor Michelle - soft eng, board member (PM...if you ask nicely) Ethan - instructor Oby - elec eng

Approaches

Discussion on varying approaches and implementations

Approach to project implementation

  1. Collaborative - work as a group on the same project (something new, something done before)
  2. Independent - everyone work independently on their projects

Approach to tech implementation

  1. Use an SEM
    1. Option 1 - get enough of the SEM fixed to operate manually
    2. Option 2 - get the full SEM working
    3. Option 3 - get the obviously broken part fabricated and replace it (part on back with dent in back of the SEM)
    4. Option 4 - do Project Awesome fundraising project
    5. Option 5 - the sputtering system issue needs to be resolved as part of the microfab process
    6. Option 6 - a cleaning chamber issue needs to be resolved as part of the microfab process
    7. Option 7 - working with hydrogen chloride indoors to etch glass issue needs to be resolved as part of the microfab process
    8. Option 8 - decide on wet etching vs. dry etching
    9. Option 9 - "rent" Ethan's personal-use SEM (assuming its working)
  2. Use The-Next-Best-Thing
    1. Option 1 - Sonic 8K - can -- stick PCB to layers of resin directly to fabricate things at 28 microns
    2. Option 2 - electro chemical plating
    3. Option 3 - UV lithography
    4. Option 4 - electron beam lithography
    5. Option 5 - "do what's been done before" (Ethan)
    6. Option 6 - "create a diode"...the simplest component we can start fabricating (Tristan)
    7. Option 7 - "create a DIY sputtering" system and publish results to community (Ethan)
More on Outsource approach:

tech is moving so fast that the Fab Shops of yesterday doing "1000 nanoML" are obsolete for commercial business/work doing "50 nanoML" and so then outsource to smaller clients that maybe "1000 nanoML" is all they need

Outsource the Fab Work (they have open time/space to run "shuttles" - groups sponsor); They split the cost among a bunch of people. Can get ICs manufactured for $650-$1000. They get put in "shuttles" which people apply for and get decided upon by "lottery." See Skywater link.

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