Category:Photolithography PCB Fab
From HacDC Wiki
When the 10mil isolation paths offered by CNC Milling are insufficient, photolithography becomes the PCB fabrication method of choice.
The process is simple, consisting of: 1) Dry film photoresist, laminated onto copper clad board by laminator. 2) UV exposure. Can be done by UV laser strapped to CNC mill or high-resolution inkjet printed transparencies and various random light sources (eg. sunlight, CFLs, etc). 3) Development. Strong basic solution (sodium carbonate seems preferred) chemically removes exposed resist. 4) Etching. Acid solution removes exposed copper. 5) Via/hole drilling, punching. Can be done automatically on CNC mill.
HacDC has all the required materials except the dry film photoresist and sodium carbonate.