Revision as of 23:14, 12 February 2016

Goals

World peace. Also:

A laser cutting device.
A 3D Printer.
A pick and place and solder paste and laser soldering machine.
PCB fab through resist application, laser resist removal, and etchant application.
Air flow controls
- forcing air down (cooling a 3d print)
- pulling air across and out (laser cutting)

A single plastic extruder, for 3d printing.
A part lifting nozzle, for pick and place functionality. -- http://www.robotdigg.com/product/517/Nozzle+w/+Adapter+to+5mm+Hollow+Shaft+Stepper
Laser(s?). For cutting.
Epson ink jet head, for Liquid Deposition (PCB resist)
Unknown, for etchant deposition.

Rackmountable footprint. ~17 inches wide, ~24 inches deep. http://www.server-racks.com/eia-310.html

@@ Line 7: / Line 7: @@
 * A pick and place and solder paste and laser soldering machine.
 * PCB fab through resist application, laser resist removal, and etchant application.
+* Air flow controls
+** forcing air down (cooling a 3d print)
+** pulling air across and out (laser cutting)
-=Features=
+=Tools=
 * A single plastic extruder, for 3d printing.
 * A part lifting nozzle, for pick and place functionality. -- http://www.robotdigg.com/product/517/Nozzle+w/+Adapter+to+5mm+Hollow+Shaft+Stepper
 * Laser(s?). For cutting.
-* Liquid Deposition (epson ink jet, for resist)
+* Epson ink jet head, for Liquid Deposition (PCB resist)
-* Etchant deposition. (unknown)
+* Unknown, for etchant deposition.
-* Air flow controls
-** forcing air down (cooling a 3d print)
-** pulling air across and out (laser cutting)
 =Constraints=