RostockMax OperatorsLog: Difference between revisions
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[[Category:RostockMax]] | [[Category:RostockMax]] | ||
'''When you use the | '''When you use the Rostock Max V2, please add notes here. Newest at top.''' | ||
* Upgraded extruder and heated bed both performing admirably. [[User:Mirage335|Mirage335]] ([[User talk:Mirage335|talk]]) 15:13, 14 April 2015 (PDT) | |||
* Removed the Extruder part that was printed with the Elmers Disspaering Purgle glue applied to the bed. Removal was much easier than expected and residue was easy to remove. --[[User:Nostromo|Nostromo]] ([[User talk:Nostromo|talk]]) 09:17, 12 February 2015 (PST) | |||
* Installed new 24V heatbed PSU and MOSFET control circuitry. Need to install connectors and better heatsink. [[User:Mirage335|Mirage335]] ([[User talk:Mirage335|talk]]) 21:07, 16 October 2014 (PDT) | * Installed new 24V heatbed PSU and MOSFET control circuitry. Need to install connectors and better heatsink. [[User:Mirage335|Mirage335]] ([[User talk:Mirage335|talk]]) 21:07, 16 October 2014 (PDT) | ||
* Replaced MOSFET heatsink, replaced borosilicate glass print surface, added optoisolated gate drive circuit. [[User:Mirage335|Mirage335]] ([[User talk:Mirage335|talk]]) 18:42, 14 December 2014 (PST) | * Replaced MOSFET heatsink, replaced borosilicate glass print surface, added optoisolated gate drive circuit. [[User:Mirage335|Mirage335]] ([[User talk:Mirage335|talk]]) 18:42, 14 December 2014 (PST) | ||
Latest revision as of 22:13, 14 April 2015
When you use the Rostock Max V2, please add notes here. Newest at top.
- Upgraded extruder and heated bed both performing admirably. Mirage335 (talk) 15:13, 14 April 2015 (PDT)
- Removed the Extruder part that was printed with the Elmers Disspaering Purgle glue applied to the bed. Removal was much easier than expected and residue was easy to remove. --Nostromo (talk) 09:17, 12 February 2015 (PST)
- Installed new 24V heatbed PSU and MOSFET control circuitry. Need to install connectors and better heatsink. Mirage335 (talk) 21:07, 16 October 2014 (PDT)
- Replaced MOSFET heatsink, replaced borosilicate glass print surface, added optoisolated gate drive circuit. Mirage335 (talk) 18:42, 14 December 2014 (PST)